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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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2019 20th International Conference on Electronic Packaging Technology(ICEPT) - 最新文献

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First-principle study of gas adsorption on SiGe monolayer as sensor applications

Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245821 Xiang Sun, K. Liang, Fang Dong, Zhen Wang, Sheng Liu

Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates

Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245207 Min-bo Zhou, Han Zhang, Xin-Ping Zhang, W. Yue

Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy

Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245328 Chunyan Lu, F. Huang, Mingliang L. Huang
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