Corrigendum to “Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint” [Mater. Design 215 (2022) 110485]
已完结10由 Pantagruel 发布于 2025/11/5 20:50:49
DOI:10.1016/j.matdes.2022.110693
作者:Peng-cheng Huan, Xiaoqi Tang, Qian Sun, Katoh Akira, Xiaoning Wang, Jie Wang, Jialong Wang, Xiajuan Wei, H. Di
文献类型:期刊论文
补充材料:只需要正文