Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

已完结 10 由方小鱼发布于 2026/1/15 12:07:51

DOI:10.1115/ipack2021-74199
作者：S. Lee, J. Lo, X. Qiu, N. Tu
文献类型：期刊论文
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American Society of Mechanical Engineers (ASME)

Abstract： Re-distribution layer (RDL) is one key enabling technology for advance packaging. RDL is usually fabricated in wafer level by photolithography process. An alternative approach for implemen

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