Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging
待确认10由 jiayu 发布于 2026/1/23 14:31:47
DOI:10.1016/j.apsusc.2025.162466
作者:Huy Hoang Chu , Dae Hee Kim , Jun Hyung Park , Sukkyung Kang , Jaiho Son , Hyunmin Lee , Hongki Yoo , Seung-Woo Kim , Sanha Kim , Young-Jin Kim
文献类型:期刊论文
补充材料:只需要正文