Crack‐Growing Interlayer Design for Deep Crack Propagation and Ultrahigh Sensitivity Strain Sensing
已完结10由 adi 发布于 2025/12/12 9:42:49
DOI:10.1002/adfm.202516625
作者:Minho Kim, Taewi Kim, Jieun Park, Insic Hong, Myungrae Hong, Seonggyeong Park, Beomjin Kim, Sehyuk Ahn, Siwoo Jang, Seungyong Han, Je‐Sung Koh, Daeshik Kang
文献类型:期刊论文
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