Comparison between cure kinetics by means of dynamic rheology and DSC of formaldehyde-based wood adhesives
待确认10由 Jz 发布于 2026/3/18 9:49:28
DOI:10.1080/00218464.2023.2300453
作者:Latifeh Nasseri, Catherine Rosenfeld, Pia Solt-Rindler, Roland Mitter, Johann Moser, Andreas Kandelbauer, Johannes Konnerth, Hendrikus W.G. Van Herwijnen
文献类型:期刊论文
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