Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications
已完结10由 croc 发布于 2026/2/13 15:31:31
DOI:10.1016/j.mattod.2025.03.011
作者:Zihao Lin , Zhijian Sun , Wenbin Fu , Yu-Chieh Lin , Kyoung-sik Moon , C.P. Wong
文献类型:期刊论文
补充材料:只需要正文