Integration of laser-induced firing with Ni/Cu plating for TOPCon solar cell metallization

已完结 10 由回眸驻守发布于 2026/3/3 9:25:07

DOI:10.1016/j.solmat.2026.114198
作者：Jingyun Zhang ,?Xi Xi ,?Jianbo Shao ,?Yuhan Li ,?Zhipeng Liu ,?Meixian Huang ,?Song Zhang ,?Hongyan Lu ,?Fan Zhu ,?Yusen Qin ,?Jingjia Ji
文献类型：期刊论文
补充材料：只需要正文

Elsevier

Abstract：Electroplating metallization technology excels in cost reduction and efficiency improvement of TOPCon solar cells. Laser-induced firing (LIF) is widely adopted to reduce contact resistance b

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