Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)

Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks

Pub Date : 2001-03-22 DOI: 10.1109/STHERM.2001.915159 D. Gopinath, Y. Joshi, S. Azarm

Thermal-mechanical measurements and analysis of an advanced thermal interface material construction

Pub Date : 2001-03-22 DOI: 10.1109/STHERM.2001.915147 F. Raiszadeh, E. Derian

Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method

Pub Date : 2001-03-22 DOI: 10.1109/STHERM.2001.915141 Z. Khatir, S. Lefebvre