International journal of high speed electronics

257

微信好友朋友圈 QQ好友复制链接

查看最新文献

发文信息

International journal of high speed electronics - 最新文献

查看全部

FIBER DIAMETER-DRIVEN MODULATION OF CELL BEHAVIOR IN DECM-ENRICHED ELECTROSPUN SCAFFOLDS FOR BONE TISSUE ENGINEERING.

Pub Date : 2026-02-01 DOI: 10.1142/S0129156426400124 Sai Sadhananth Srinivasana, Suranji Wijekoona, Allen Zennifera, Sama Abdulmalika, Sangamesh G Kumbara

Micro-Nanostructured Polymeric Scaffolds for Bone Tissue Engineering.

Pub Date : 2024-06-01 DOI: 10.1142/s0129156424400755 Sama Abdulmalik, Suranji Wijekoon, Khadija Basiru Danazumi, Sai Sadhananth Srinivasan, Laxmi Vobbineni, Elifho Obopilwe, Sangamesh G Kumbar

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。

Book学术文献互助群
群号：604180095

文献互助智能选刊最新文献互助须知联系我们：info@booksci.cn

Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。

International journal of high speed electronics

发文信息

同类期刊

International journal of high speed electronics - 最新文献

FIBER DIAMETER-DRIVEN MODULATION OF CELL BEHAVIOR IN DECM-ENRICHED ELECTROSPUN SCAFFOLDS FOR BONE TISSUE ENGINEERING.

Micro-Nanostructured Polymeric Scaffolds for Bone Tissue Engineering.