Effect of the PMMA Buffer Layer on the Electrical Stability of CuI Memristor

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2026-10-13 Epub Date: 2026-10-01 DOI:10.1021/acsaelm.6c01566
Danbi Lee, Jeong-Ju Bae, Hojun Kim, Chunghoe Kim, Suyeon Im, Je-Jun Lee, Hyunjoon Kim, Yongha Kim, Ji-Hyun Cha, Min Sup Choi
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Abstract

Electrochemical metallization-based memristors have attracted considerable attention as artificial synaptic devices owing to their ion-mediated conductance modulation. Although halide-based resistive switching (RS) layers are promising for neuromorphic applications, the use of active metals such as Ag or Cu as the top electrode (TE) can induce unstable switching behavior through unwanted interfacial reactions and metal migration into the halide layer. In this study, a poly(methyl methacrylate) (PMMA) buffer layer was inserted between the Ag TE and the CuI RS layer to improve the electrical and structural stability of CuI-based memristors. The PMMA buffer layer suppressed Ag diffusion into the CuI layer, thereby preserving the Ag TE for up to six months. This suppression of electrode degradation consequently enabled stable resistive switching and long-term electrical stability without significant degradation. X-ray diffraction and time-dependent scanning electron microscopy – energy dispersive X-ray spectroscopy analyses were performed to investigate the presence of Ag and its diffusion behavior over time. In addition, ABAQUS-based finite element analysis was conducted to simulate the time-dependent Ag concentration distribution, revealing that the maximum Ag concentration in the PMMA/CuI device was reduced by approximately 88% compared with that in the device without PMMA. The synaptic characteristics of the devices were further evaluated through long-term potentiation and depression measurements and implemented in artificial neural network simulation. As a result, the recognition accuracy increased from 66.0% for the CuI device to 79.4% for the PMMA/CuI device, corresponding to an approximately 20% improvement. Furthermore, spike-dependent conductance modulation was demonstrated by varying the spike amplitude, number, and duration, confirming the capability of the PMMA/CuI device to emulate synaptic weight modulation. These results demonstrate that PMMA acts as an effective diffusion-modulating buffer layer for improving the reliability of CuI-based artificial synaptic devices.

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PMMA缓冲层对CuI忆阻器电稳定性的影响
基于电化学金属化的忆阻器由于其离子介导的电导调制而作为人工突触器件引起了广泛的关注。尽管基于卤化物的电阻开关(RS)层在神经形态应用方面很有前景,但使用活性金属(如Ag或Cu)作为顶电极(TE)可能会通过不必要的界面反应和金属迁移到卤化物层中来诱导不稳定的开关行为。在本研究中,在Ag TE和CuI RS层之间插入聚甲基丙烯酸甲酯(PMMA)缓冲层,以提高CuI基忆阻器的电学和结构稳定性。PMMA缓冲层抑制了Ag向CuI层的扩散,从而将Ag TE保存长达6个月。这种对电极退化的抑制使得稳定的电阻开关和长期的电稳定性没有显著的退化。通过x射线衍射和时间依赖扫描电子显微镜-能量色散x射线光谱分析来研究银的存在及其随时间的扩散行为。此外,基于abaqus的有限元分析模拟了随时间变化的Ag浓度分布,结果表明,PMMA/CuI器件中的最大Ag浓度比不含PMMA器件中的最大Ag浓度降低了约88%。通过长期增强和抑制测量进一步评估装置的突触特性,并在人工神经网络模拟中实现。结果,识别准确率从CuI设备的66.0%提高到PMMA/CuI设备的79.4%,相当于提高了约20%。此外,通过改变峰值幅度、数量和持续时间,证明了峰值依赖性电导调制,证实了PMMA/CuI器件模拟突触权重调制的能力。这些结果表明,PMMA作为一种有效的扩散调制缓冲层,可以提高基于gui的人工突触器件的可靠性。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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