Pub Date : 2024-11-27DOI: 10.1109/OJNANO.2024.3494770
Juo Lee;Sungmin Lee;Iksong Byun;Myung Chul Lee;Jungsil Kim;Hoon Seonwoo
In bone tissue engineering, various approaches have been investigated to enhance osteogenic regeneration. Previous studies have predominantly employed scaffolds with aligned structures or reduced graphene oxide (RGO) to facilitate bone regeneration. However, current scaffold designs face limitations in combining structural guidance with effective electromagnetic stimulation. Additionally, delivering localized stimulation within scaffolds remains a challenge in maximizing the potential of these materials for bone regeneration. To address these limitations and strengthen previous approaches, this study presents a novel strategy in tissue engineering for enhanced osteogenic differentiation. RGO-incorporated nanofibers (RGO-NFs) were fabricated via electrospinning a 10% polycaprolactone (PCL) solution with RGO concentrations varying. The random fibers were deposited on a planar surface, while the aligned fibers were deposited on a rotating drum. The morphology and orientation of the fibers were confirmed through electron microscopy. X-ray diffraction spectrometry was employed to confirm the integration of RGO and PCL. All groups demonstrated optimal cell adhesion and viability. RGO-NFs exhibited higher osteogenesis-related protein expression than PCL-only scaffolds, further enhanced by pulsed electromagnetic field (PEMF) application. The application of PEMF stimulation within aligned RGO-NFs presents a potentially more efficient alternative to existing methods, offering a novel, non-invasive therapeutic strategy for bone defect regeneration.
{"title":"Pulsed Electromagnetic Field-Assisting Reduced Graphene Oxide-Incorporated Nanofibers for Osteogenic Differentiation of Human Dental Pulp Stem Cells","authors":"Juo Lee;Sungmin Lee;Iksong Byun;Myung Chul Lee;Jungsil Kim;Hoon Seonwoo","doi":"10.1109/OJNANO.2024.3494770","DOIUrl":"https://doi.org/10.1109/OJNANO.2024.3494770","url":null,"abstract":"In bone tissue engineering, various approaches have been investigated to enhance osteogenic regeneration. Previous studies have predominantly employed scaffolds with aligned structures or reduced graphene oxide (RGO) to facilitate bone regeneration. However, current scaffold designs face limitations in combining structural guidance with effective electromagnetic stimulation. Additionally, delivering localized stimulation within scaffolds remains a challenge in maximizing the potential of these materials for bone regeneration. To address these limitations and strengthen previous approaches, this study presents a novel strategy in tissue engineering for enhanced osteogenic differentiation. RGO-incorporated nanofibers (RGO-NFs) were fabricated via electrospinning a 10% polycaprolactone (PCL) solution with RGO concentrations varying. The random fibers were deposited on a planar surface, while the aligned fibers were deposited on a rotating drum. The morphology and orientation of the fibers were confirmed through electron microscopy. X-ray diffraction spectrometry was employed to confirm the integration of RGO and PCL. All groups demonstrated optimal cell adhesion and viability. RGO-NFs exhibited higher osteogenesis-related protein expression than PCL-only scaffolds, further enhanced by pulsed electromagnetic field (PEMF) application. The application of PEMF stimulation within aligned RGO-NFs presents a potentially more efficient alternative to existing methods, offering a novel, non-invasive therapeutic strategy for bone defect regeneration.","PeriodicalId":446,"journal":{"name":"IEEE Open Journal of Nanotechnology","volume":"5 ","pages":"124-133"},"PeriodicalIF":1.8,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10769987","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142736342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-26DOI: 10.1109/TSM.2024.3506312
{"title":"2024 Index IEEE Transactions on Semiconductor Manufacturing Vol. 37","authors":"","doi":"10.1109/TSM.2024.3506312","DOIUrl":"https://doi.org/10.1109/TSM.2024.3506312","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"649-667"},"PeriodicalIF":2.3,"publicationDate":"2024-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10768858","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142713825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3490742
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing","authors":"","doi":"10.1109/TSM.2024.3490742","DOIUrl":"https://doi.org/10.1109/TSM.2024.3490742","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"647-647"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766045","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3455875
{"title":"Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation","authors":"","doi":"10.1109/TSM.2024.3455875","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455875","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"645-646"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765976","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3455873
{"title":"Call for Papers: Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices","authors":"","doi":"10.1109/TSM.2024.3455873","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455873","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"643-644"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766043","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3485049
Oliver D. Patterson;Tomasz Brozek;Kaushik Balamukundhan;David M. Fried;Bill Nehrer;Suresh Ramarajan
{"title":"Guest Editorial Special Section on Sustainability","authors":"Oliver D. Patterson;Tomasz Brozek;Kaushik Balamukundhan;David M. Fried;Bill Nehrer;Suresh Ramarajan","doi":"10.1109/TSM.2024.3485049","DOIUrl":"https://doi.org/10.1109/TSM.2024.3485049","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"418-421"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766050","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142691709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3455877
{"title":"IEEE Transactions on Semiconductor Manufacturing Information for Authors","authors":"","doi":"10.1109/TSM.2024.3455877","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455877","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765978","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3504213
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TSM.2024.3504213","DOIUrl":"https://doi.org/10.1109/TSM.2024.3504213","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"648-648"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766042","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}