Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089847
S. Lefteriu, A. Antoulas
System identification from frequency domain data arises in many areas, e.g., in control, electronics, mechanical and civil engineering and many other fields. Currently available techniques work well for the single input single output case. However, for the case of large numbers of inputs and outputs, present methods are expensive. This paper proposes a new approach which is based on the concept of tangential interpolation. Our approach allows the identification of the underlying system using small CPU times. The numerical results we present show that our algorithms yield more accurate models in less time, when compared to the column-wise implementation of vector fitting.
{"title":"Modeling multi-port systems from frequency response data via tangential interpolation","authors":"S. Lefteriu, A. Antoulas","doi":"10.1109/SPI.2009.5089847","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089847","url":null,"abstract":"System identification from frequency domain data arises in many areas, e.g., in control, electronics, mechanical and civil engineering and many other fields. Currently available techniques work well for the single input single output case. However, for the case of large numbers of inputs and outputs, present methods are expensive. This paper proposes a new approach which is based on the concept of tangential interpolation. Our approach allows the identification of the underlying system using small CPU times. The numerical results we present show that our algorithms yield more accurate models in less time, when compared to the column-wise implementation of vector fitting.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"225 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114472409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089837
M. Voutilainen, M. Rouvala, P. Kotiranta, T. Von Rauner
Future mobile terminal digital interconnections are introducing spectrum components in cellular frequencies in an increasing manner. Control of interconnection impedance and common mode noise introduced from them are key elements for robust device design. Electromagnetic coupling from multi-gigabit serial links used for display and camera data transmission in mobile device to positioning and cellular wireless communication receivers depends mainly on common-mode content of serial link signal, and on common-mode coupling strength between the serial link interconnection and cellular receiver antenna. Frequency spectrum of common-mode component of serial link output voltage and current are determined by simulations or measurements, and 8-port S-parameters are used in calculations of induced disturbance power coupled to cellular receiver. Minimum required common-mode attenuation was found to be typically −60dB.
{"title":"Multi-gigabit serial link emissions and mobile terminal antenna interference","authors":"M. Voutilainen, M. Rouvala, P. Kotiranta, T. Von Rauner","doi":"10.1109/SPI.2009.5089837","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089837","url":null,"abstract":"Future mobile terminal digital interconnections are introducing spectrum components in cellular frequencies in an increasing manner. Control of interconnection impedance and common mode noise introduced from them are key elements for robust device design. Electromagnetic coupling from multi-gigabit serial links used for display and camera data transmission in mobile device to positioning and cellular wireless communication receivers depends mainly on common-mode content of serial link signal, and on common-mode coupling strength between the serial link interconnection and cellular receiver antenna. Frequency spectrum of common-mode component of serial link output voltage and current are determined by simulations or measurements, and 8-port S-parameters are used in calculations of induced disturbance power coupled to cellular receiver. Minimum required common-mode attenuation was found to be typically −60dB.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124585536","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089854
M. Kotzev, R. Rímolo-Donadío, C. Schuster
This paper presents results for the error boxes (two-port scattering parameters) of ground-signal-ground (GSG) mini-coaxial probes (microprobes) and recessed probe launches up to 20 GHz. The recessed probe launch uses internal GSG pads for the access of embedded printed circuit board (PCB) structures without the need for signal vias. The error boxes were obtained by using two-tier calibration techniques where the first tier was based on short-open-load-through (SOLT) and the second tier on short-open-load (SOL) or through-reflect-line (TRL) calibration algorithms. Results from different calibration set ups are compared with each other and agree well. The obtained error boxes can be used for deembedding or analysis of the microprobe and probe launch performance.
{"title":"Extraction of broadband error boxes for microprobes and recessed probe launches for measurement of printed circuit board structures","authors":"M. Kotzev, R. Rímolo-Donadío, C. Schuster","doi":"10.1109/SPI.2009.5089854","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089854","url":null,"abstract":"This paper presents results for the error boxes (two-port scattering parameters) of ground-signal-ground (GSG) mini-coaxial probes (microprobes) and recessed probe launches up to 20 GHz. The recessed probe launch uses internal GSG pads for the access of embedded printed circuit board (PCB) structures without the need for signal vias. The error boxes were obtained by using two-tier calibration techniques where the first tier was based on short-open-load-through (SOLT) and the second tier on short-open-load (SOL) or through-reflect-line (TRL) calibration algorithms. Results from different calibration set ups are compared with each other and agree well. The obtained error boxes can be used for deembedding or analysis of the microprobe and probe launch performance.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124629250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089845
G. Antonini, F. Ferranti, T. Dhaene, L. Knockaert
We introduce a novel parametrization scheme for lossy and dispersive multiconductor transmission lines (MTLs) having a cross-section depending on geometrical and physical parameters, that is suitable to interconnect modeling. The proposed approach is based on the dyadic Green's function method for the analysis of lossy and dispersive MTLs which is parameterized by using the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. Design parameters, such as substrate or geometrical layout features, in addition to frequency, can be easily handled. The rational form of the multi-port macromodel describing the MTL is a direct consequence of the MOVF technique and is especially suited to generate state-space macromodels or to be synthesized into equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. A numerical example is presented providing evidence of the accuracy of the proposed approach in both frequency and time-domain.
{"title":"Parameterized macromodels of multiconductor transmission lines","authors":"G. Antonini, F. Ferranti, T. Dhaene, L. Knockaert","doi":"10.1109/SPI.2009.5089845","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089845","url":null,"abstract":"We introduce a novel parametrization scheme for lossy and dispersive multiconductor transmission lines (MTLs) having a cross-section depending on geometrical and physical parameters, that is suitable to interconnect modeling. The proposed approach is based on the dyadic Green's function method for the analysis of lossy and dispersive MTLs which is parameterized by using the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. Design parameters, such as substrate or geometrical layout features, in addition to frequency, can be easily handled. The rational form of the multi-port macromodel describing the MTL is a direct consequence of the MOVF technique and is especially suited to generate state-space macromodels or to be synthesized into equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. A numerical example is presented providing evidence of the accuracy of the proposed approach in both frequency and time-domain.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114354123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089861
T. Maestri, I. Elfadel, A. Ruehli
In this paper, we present a novel fast algorithm for Transverse Waveform Relaxation (TWR) using waveform compression. The core concept of the algorithm is to eliminate redundancies in TWR waveforms signals both before and after the relaxation source update step of the traditional TWR process. The new TWR algorithm is implemented using the application programming interface of an industrial circuit simulation program and is illustrated on a test suite of on-chip data buses having up to 40 coupled transmission lines. Numerical simulations show that speedups as high as 12X can be achieved with respect to a TWR algorithm without waveform compression.
{"title":"Acceleration of Transverse Waveform Relaxation using waveform compression","authors":"T. Maestri, I. Elfadel, A. Ruehli","doi":"10.1109/SPI.2009.5089861","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089861","url":null,"abstract":"In this paper, we present a novel fast algorithm for Transverse Waveform Relaxation (TWR) using waveform compression. The core concept of the algorithm is to eliminate redundancies in TWR waveforms signals both before and after the relaxation source update step of the traditional TWR process. The new TWR algorithm is implemented using the application programming interface of an industrial circuit simulation program and is illustrated on a test suite of on-chip data buses having up to 40 coupled transmission lines. Numerical simulations show that speedups as high as 12X can be achieved with respect to a TWR algorithm without waveform compression.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131316727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089843
P. Gunupudi, T. Smy, J. Klein, J. Jakubczyk
This paper presents a self-consistent simulation methodology for co-simulation of optical and electrical components in a SPICE-like simulation framework. The framework specifies a flexible optical signal structure that allows for bi-directional optical signals, polarization, optical interference and source/detector non-linearities. A C implementation of this method was successfully tested on several industry standard optoelectronic circuits and satisfactory results were obtained.
{"title":"Self-consistent simulation of optoelectronic circuits using a SPICE-like framework","authors":"P. Gunupudi, T. Smy, J. Klein, J. Jakubczyk","doi":"10.1109/SPI.2009.5089843","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089843","url":null,"abstract":"This paper presents a self-consistent simulation methodology for co-simulation of optical and electrical components in a SPICE-like simulation framework. The framework specifies a flexible optical signal structure that allows for bi-directional optical signals, polarization, optical interference and source/detector non-linearities. A C implementation of this method was successfully tested on several industry standard optoelectronic circuits and satisfactory results were obtained.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124756664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089863
Agnieszka Ligocka-Wardzinska, W. Bandurski
The paper presents a sensitivity analysis of step and ramp response of VLSI interconnects to geometrical dimensions of microstrip model of higher level interconnects. The method is based on analytical form of VLSI output response calculated using multiple scales method.
{"title":"Sensitivity of output response to geometrical dimensions in VLSI interconnects","authors":"Agnieszka Ligocka-Wardzinska, W. Bandurski","doi":"10.1109/SPI.2009.5089863","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089863","url":null,"abstract":"The paper presents a sensitivity analysis of step and ramp response of VLSI interconnects to geometrical dimensions of microstrip model of higher level interconnects. The method is based on analytical form of VLSI output response calculated using multiple scales method.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129390096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089867
A. Tsuchiya, H. Onodera
This paper discusses the effect of CMP dummy fill on on-chip transmission-lines. In recent fabrication processes that use Cu wire, CMP dummy fill is inserted to suppress the variation of the metal thickness. In high frequency above 10GHz, the eddy current in the dummy fills affects the characteristics of on-chip transmission-line. However it is not clear that which dummy fill has the strong impact. This paper evaluates the relationship between the effect and the location of dummy fills by a 3D field-solver. The experimental results show that there is a region where the dummy fills have strong impact on the loss characteristics. The effect of the dummy fills in the region is nearly two times larger than that in the other region.
{"title":"Effect of underlayer dummy fills on on-chip transmission line","authors":"A. Tsuchiya, H. Onodera","doi":"10.1109/SPI.2009.5089867","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089867","url":null,"abstract":"This paper discusses the effect of CMP dummy fill on on-chip transmission-lines. In recent fabrication processes that use Cu wire, CMP dummy fill is inserted to suppress the variation of the metal thickness. In high frequency above 10GHz, the eddy current in the dummy fills affects the characteristics of on-chip transmission-line. However it is not clear that which dummy fill has the strong impact. This paper evaluates the relationship between the effect and the location of dummy fills by a 3D field-solver. The experimental results show that there is a region where the dummy fills have strong impact on the loss characteristics. The effect of the dummy fills in the region is nearly two times larger than that in the other region.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127869786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089865
D. Lu, Chunxing Huang, Xiaoqing Dong, Daoxue Hu
For high-speed serial links, the most important performance measurement is the bit error rate (BER). Many papers have proposed methods to calculate or estimate the BER under the conditions of systems with Jitter and ISI. One of these, StatEye method is very popular, using colored BER contours in StatEye, the BER can be estimated.
{"title":"SPI proceedings: BER simulation for high-speed serial links with crosstalk, noise, ISI and Jitter using Quasi-Analytical Method","authors":"D. Lu, Chunxing Huang, Xiaoqing Dong, Daoxue Hu","doi":"10.1109/SPI.2009.5089865","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089865","url":null,"abstract":"For high-speed serial links, the most important performance measurement is the bit error rate (BER). Many papers have proposed methods to calculate or estimate the BER under the conditions of systems with Jitter and ISI. One of these, StatEye method is very popular, using colored BER contours in StatEye, the BER can be estimated.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"207 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122510179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-05-12DOI: 10.1109/SPI.2009.5089868
L. Svensson, J. Pihl, D. Andersson, Bjorn Nilsson, P. Larsson-Edefors
We investigate the influence of a realistic supply voltage network on the timing margins for a commercially-available 32-bit processor chip. Detailed models of the supply network and switching activity produce a spatial map of the supply voltage waveforms. We relate these waveforms to the expected excess logic delays, and estimate the required derating of the critical setup paths.
{"title":"Towards supply-grid-based derating of timing margins","authors":"L. Svensson, J. Pihl, D. Andersson, Bjorn Nilsson, P. Larsson-Edefors","doi":"10.1109/SPI.2009.5089868","DOIUrl":"https://doi.org/10.1109/SPI.2009.5089868","url":null,"abstract":"We investigate the influence of a realistic supply voltage network on the timing margins for a commercially-available 32-bit processor chip. Detailed models of the supply network and switching activity produce a spatial map of the supply voltage waveforms. We relate these waveforms to the expected excess logic delays, and estimate the required derating of the critical setup paths.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132795203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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