Poly(m-phenylene isophthalamide) (PMIA)-based insulating paper exhibits excellent electrical insulation and mechanica l properties, including higher breakdown strength (Eb) than conventional cellulose insulating paper. However, its intrinsically low thermal conductivity limits heat dissipation in oil-paper insulation systems, causing Joule heat accumulation, insulation degradation, and thermal breakdown. Herein, we report PMIA-based composite papers prepared by binary multidimensional doping the small-size 0D sphere-like aluminum nitride (AlN) filler with large-size 3D sphere-like, 2D lamellar-like, and 1D wire-like AlN fillers, respectively. At the same total filler volume fraction, large-size fillers with different morphologies show distinct advantages. For electrical insulation, the 2D lamellar-like filler most effectively enhances Eb by optimizing trap characteristics and mitigating electric field distortion, reaching 284.3 kV/mm, 29.5% higher than that of the 0D-only doped sample (N15). For thermal conduction, 3D sphere-like filler is most effective in enhancing the out-of-plane thermal conductivity (k⊥) by reducing thermal resistance, reaching 0.282 W/(m·K) and representing a 14.5% improvement over N15. In contrast, 1D wire-like and 2D lamellar-like fillers are more favorable for constructing in-plane heat transfer pathways, yielding in-plane thermal conductivity (k//) values of 0.546 W/(m·K) and 0.386 W/(m·K), respectively. Moreover, finite element analysis further reveals the morphology-dependent electric and thermal field distributions in the composites.