In the twin-roll strip casting process, high-temperature molten metal solidifies upon contact with casting rolls, leading to complex heat transfer during solidification. However, few studies have simultaneously addressed the solidification heat transfer and wettability of copper alloys. This study experimentally investigates the interfacial heat transfer behavior of the Cu-9Ni-6Sn alloy under varying coating thickness and surface roughness. Temperature evolution profiles were obtained to characterize heat transfer performance under different substrate conditions. Numerical simulations were further employed to validate the experimental temperature curves and to further examine the wettability and spreading behavior of copper alloy droplets during solidification on metal substrates, confirming the robustness of the computational model. The results indicate that the copper substrate, due to its high thermal conductivity, exhibits faster heating and cooling rates and maintains lower temperatures compared to a steel substrate. Increasing the coating thickness reduces heat transfer efficiency, however, the combined effects of interfacial thermal resistance and coating thermal resistance diminish the marginal gains in thermal insulation. Furthermore, increasing substrate surface roughness impedes liquid alloy flow due to microscale asperities, promoting the formation of localized eddy currents and stagnation zones that enhance heat accumulation and localized heat transfer to the substrate. Simulations further reveal that the number of secondary droplets formed during splashing is lower on steel substrates than on copper substrates, and the droplet spreading distance increases with impact velocity within the range of 0∼0.3 m/s. These findings provide valuable insights into the heat transfer and solidification mechanisms of copper alloys during twin-roll strip casting.


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