The study investigates the heat transfer characteristics and bubble behavior of a multi-chip system cooled by two-phase immersion cooling technique, with particular focus on the role of inter-chip components on the overall performance. Experiments were conducted for five blockage ratios (B = 0, 0.25, 0.5, 0.75, and 1), representing varying levels of obstruction to vapor flow between the chips. Two operational modes were examined: (i) activation of two vertically adjacent chips and (ii) activation of all seven chips. High-speed imaging was employed to analyze bubble behavior at critical locations- during departure from the lower chip, the inter-chip component and the upper chip. Additionally, an artificial neural network-genetic algorithm (ANN-GA) framework was developed to identify the optimal heat flux distributions corresponding to a predefined chip temperature limit. Results indicate that the presence and geometry of inter-chip components significantly influence thermal uniformity and bubble behavior. The optimum performance was obtained at B = 0.25, which improved the temperature uniformity coefficient and reduced the maximum chip-to-chip temperature difference by nearly 50% compared to the configuration without inter-chip components. Bubble imaging revealed that this configuration promotes coalescence-induced bubble departure, enhancing evaporative heat transfer at the upper chip. For the seven-chip configuration, the influence of blockage ratio was less pronounced but still yielded approximately 15% improvement in temperature uniformity at B = 0.25. The ANN-GA framework demonstrated a strong predictive capability (correlation coefficient 0.96) and suggested that adopting the optimal blockage ratio could increase the total allowable heat load by roughly 20% for a fixed chip temperature limit. These findings provide insights into the coupled effects of inter-chip geometry, bubble dynamics and thermal performance, offering design guidance for thermally efficient multi-chip layouts in two-phase immersion-cooled systems.


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